Adhesion & Bonding Expo Osaka

Adhesion & Bonding Expo Osaka is Japan’s leading trade fair for industrial adhesive and bonding technologies. Held annually at the INTEX Osaka International Exhibition Center—one of the country’s most advanced venues—it benefits from a strategic location near Kansai International Airport and the Port of Osaka. The event is organized by RX Japan Ltd., a seasoned subsidiary of the Reed Exhibitions Group, known for its expertise in delivering high-quality international trade shows.

As part of the renowned Highly-Functional Material Week, the Adhesion & Bonding Expo brings together specialized companies, technology leaders, and industry professionals from around the world. The exhibition focuses on industrial applications related to adhesion, featuring adhesives, sealants, advanced joining methods, and surface treatment technologies. The range of solutions on display is particularly noteworthy, spanning epoxy and polyurethane adhesives, laser welding, friction stir welding, non-destructive testing, and coating inspection. These technologies play a vital role in sectors such as automotive, aerospace, electronics, construction, and medical technology.

A key highlight of the event is its emphasis on the joining of dissimilar materials—such as metal and plastic—a growing challenge in modern manufacturing. In addition to a comprehensive product showcase, the expo offers a high-level conference program where international experts present cutting-edge research, case studies, and forward-looking applications.

Exhibitors primarily represent fields such as material development, mechanical engineering, chemistry, metrology, and manufacturing technology. Visitors are typically professionals from R&D, production, quality assurance, and application engineering. In addition to the Osaka edition, the expo is also held in Chiba (near Tokyo) in autumn and in Nagoya during winter. This rotating schedule ensures broad outreach to both Japan’s industrial base and international stakeholders.

With its thematic depth, global scope, and excellent accessibility, Adhesion & Bonding Expo Osaka is a key meeting point for industry professionals. The venue, INTEX Osaka, not only offers optimal conditions for exhibitors and attendees but also reflects the modern infrastructure and economic dynamism of a globally connected metropolitan region.

The Adhesion & Bonding Expo in Osaka took place from Wednesday, 14. May to Friday, 16. May 2025.