Adhesion & Bonding Expo Osaka

08. - 10. May 2024 | International trade fair for adhesives and connection technology

In 9 days

Date:
08.05.2024 - 10.05.2024*
Wednesday - Friday, 3 days

Trade Show Contact
info.jp@rxglobal.com
www.rxjapan.jp

Audience:
professional visitors only
Free admission

Cycle:
annually

The Adhesion & Bonding Expo is a significant trade fair held at INTEX Osaka, one of the largest exhibition and event centers in Japan. Founded in 1985, INTEX Osaka is conveniently located near Kansai Airport and the Port of Osaka. The Adhesion & Bonding Expo is organized by RX Japan Ltd., a subsidiary of the Reed Exhibitions Group, which specializes in organizing trade fairs and events in various industries. The fair targets companies and professionals in the fields of adhesives and sealants, surface treatment and finishing, as well as application-specific technologies and services. At the Adhesion & Bonding Expo, participants can learn about the latest products, technologies, and trends in adhesion and bonding technology. The fair's focus is on innovative solutions for industries such as automotive, aerospace, electronics, construction, and medical technology. A wide range of products and technologies relevant to various applications and industries are exhibited, including adhesives such as epoxy resins, polyurethanes, silicones, cyanoacrylates, hot-melt adhesives, and UV-curing adhesives, as well as sealants like silicone sealants, polyurethane sealants, acrylic sealants, and butyl sealants. In addition, surface treatments, adhesive application systems, and joining methods for composite materials are presented. The Adhesion & Bonding Expo is part of the Highly-functional Material Week, an event series that brings together various trade fairs focused on high-performance materials and technologies under one roof. The Highly-functional Material Week takes place annually in Osaka and serves as an essential platform for professionals and companies from different industries. In addition to the Osaka location, the Adhesion & Bonding Expo is also held in Chiba, a major exhibition center near Tokyo. The annual rotation, with the event held in Osaka in spring and Chiba near Tokyo in autumn, allows the fair to attract a broad spectrum of participants and exhibitors from various regions of Japan and beyond. This event provides participants with an excellent opportunity to present their products and services to an even larger audience and learn about the latest developments in the industry.

The Adhesion & Bonding Expo will take place on 3 days from Wednesday, 08. May to Friday, 10. May 2024 in Osaka.

Local time:
04:50 h (UTC +09:00)

Fair location:

Intex Osaka International Exhibition Center,
1-5-102, Nanko-kita, Suminoe-ku, 531-6035 Osaka, Ōsaka, Japan
Calendar entry

Fair organizer
RX Japan
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - Ku
1630570 Tokyo, Japan
info.jp@rxglobal.com
www.rxjapan.jp

Past editions:

Product groups: adhesive application systems, composite joining methods, cyanoacrylate adhesives, epoxy resin adhesives, hot melt adhesives, polyurethane adhesives, sealing materials, silicone adhesives, surface preparation technologies, …

Branchen

additive manufacturing
Petrochemicals
Plastics
Raw materials

Disclaimer: No responsibility is taken for the correctness of this information. Errors and alterations excepted! Fair dates and exhibition sites are subject to change by the respective trade fair organiser.

Research hotels in Osaka
Exhibition Centres

FAQ

Where does the Adhesion & Bonding Expo taking place?
The Adhesion & Bonding Expo fair takes place in Osaka, at the Intex Osaka International Exhibition Center.

When is the Adhesion & Bonding Expo taking place?
Visit the Adhesion & Bonding Expo from 08. - 10. May 2024.

How often does the Adhesion & Bonding Expo take place?
The Adhesion & Bonding Expo takes place annually.

What kind of fair is the Adhesion & Bonding Expo?
The Adhesion & Bonding Expo is an exhibition for additive manufacturing, Petrochemicals and Plastics.


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