Die & Mold Asia Osaka

Die & Mold Asia is an international trade fair specializing in tool and die making, as well as related manufacturing technologies. It is held annually at the INTEX Osaka International Exhibition Center in Osaka, Japan. The fair is organized by the INTERMOLD Development Association (TVO Expro Ltd.), making it a key event in Asia.

The fair has established itself as a dedicated platform targeting Asian markets. It encompasses a wide range of fields, including machine tools, forming technology, materials for mold making, 3D additive manufacturing processes, heat treatment technologies, precision equipment, and automation technology.

The event showcases the latest products and services, including high-precision machine tools and innovative software technologies. It demonstrates the advanced manufacturing capacity and innovative strength of the Asian industry and promotes both local and international collaboration.

A highlight of the fair is the various conferences and summits where experts from different industries come together. The fair serves as a platform for exchanging expertise, promoting research collaborations, and facilitating business matchmaking activities.

Exhibitors and visitors represent diverse sectors of the manufacturing industry, particularly from the toolmaking and metalworking sectors. The main visitors include professionals and decision-makers interested in the latest technologies and developments.

Die & Mold Asia is part of a series of fairs held in various Asian cities, characterized by its specific focus and depth of offerings. The INTEX Osaka International Exhibition Center is easily accessible and equipped with modern facilities, making it an ideal venue for international events of this nature. In summary, "Die & Mold Asia" is a key event for all professionals in tool and die making who are interested in the latest technologies and market trends.

The Die & Mold Asia in Osaka took place from Wednesday, 17. April to Friday, 19. April 2024.