IC & SENSOR PACKAGING EXPO Tokyo

22. - 24. January 2025 | Trade fair on IC finishing and packaging

The ISP EXPO, also known as the IC & SENSOR PACKAGING EXPO, is a trade fair focusing on the final assembly and packaging of integrated circuits (ICs). This annual event, taking place every January, was initiated by RX Japan Ltd. and has established itself as Asia's leading exhibition in this sector..

The ISP EXPO is distinguished by its comprehensive presentation of advanced equipment, materials, and services specifically designed for IC final assembly and packaging. The expo provides a unique platform for industry professionals to stay informed about the latest technologies and trends, establish business relationships, and exchange knowledge.

A key feature of the ISP EXPO is its integration with NEPCON Japan, one of the largest electronics trade fairs in Asia. This integration offers ISP EXPO participants an additional opportunity to connect with a broader range of industry experts and explore synergies with other areas of electronics manufacturing.

The fair's venue, Tokyo Big Sight, is a renowned international exhibition center in Tokyo, known for its distinctive architecture and excellent facilities. It provides an ideal setting for this high-profile event, characterized by its high-quality exhibitions and professional audience.

Highlights of the ISP EXPO include interactive lectures by industry leaders, demonstration areas for the latest products and technologies, and networking events that enable participants to establish contacts and explore business opportunities. The expo serves as an important platform for companies to showcase their latest innovations and stay informed about the challenges and opportunities in the IC packaging industry.

The IC & SENSOR PACKAGING EXPO will take place on 3 days from Wednesday, 22. January to Friday, 24. January 2025 in Tokyo.

In 272 days
Date:
22.01.2025 - 24.01.2025*
Wednesday - Friday, 3 days
Trade Show Contact
Display e-mail address
www.nepconjapan.jp

Audience:
professional visitors only

Cycle:
annually

Local time:
08:15 h (UTC +09:00)

Fair location:

Tokyo Big Sight,
3-21-1 Ariake Kotu-ku, 135-0063 Tokyo, Tokyo, Japan

Hotels

for trade fair date in Tokyo


Fair organizer
RX Japan
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - Ku
1630570 Tokyo, Japan
Display e-mail address
www.rxjapan.jp
Past editions:
  • 24. - 26. January 2024
  • 25. - 27. January 2023

Fair location:

Tokyo Big Sight,
3-21-1 Ariake Kotu-ku, 135-0063 Tokyo, Tokyo, Japan

Hotels

for trade fair date in Tokyo


Product groups: clean room technology, IC packaging systems, materials for IC packaging, microelectronics, nanotechnology, semiconductor production systems, test systems, thermal management solutions, wafer processing systems, …

Disclaimer: No responsibility is taken for the correctness of this information. Errors and alterations excepted! Fair dates and exhibition sites are subject to change by the respective trade fair organiser.

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Co-located

Other co-located events

NEPCON Japan
Electronic Components & Materials Expo
ELECTROTEST JAPAN
EV Japan
Automotive Lightweight Technology Expo
AUTOMOTIVE WORLD
Autonomous Driving Technology Expo
CAR-ELE JAPAN
CAR-MECHA JAPAN
Connected Car JAPAN
FINE PROCESS TECHNOLOGY EXPO
MaaS Expo
Power Device and Module Expo
PWB Expo
Software-Defined Vehicle Expo


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FAQ

Where does the IC & SENSOR PACKAGING EXPO taking place?
The IC & SENSOR PACKAGING EXPO fair takes place in Tokyo, at the Tokyo Big Sight.

When is the IC & SENSOR PACKAGING EXPO taking place?
Visit the IC & SENSOR PACKAGING EXPO from 22. - 24. January 2025.

How often does the IC & SENSOR PACKAGING EXPO take place?
The IC & SENSOR PACKAGING EXPO takes place annually.

What kind of fair is the IC & SENSOR PACKAGING EXPO?
The IC & SENSOR PACKAGING EXPO is an exhibition for Manufacturing Technology, Electronics and Electrical.