IC & SENSOR PACKAGING EXPO Tokyo

The ISP EXPO, also known as the IC & SENSOR PACKAGING EXPO, is a trade fair focusing on the final assembly and packaging of integrated circuits (ICs). This annual event, taking place every January, was initiated by RX Japan Ltd. and has established itself as Asia's leading exhibition in this sector.

The ISP EXPO is distinguished by its comprehensive presentation of advanced equipment, materials, and services specifically designed for IC final assembly and packaging. The expo provides a unique platform for industry professionals to stay informed about the latest technologies and trends, establish business relationships, and exchange knowledge.

A key feature of the ISP EXPO is its integration with NEPCON Japan, one of the largest electronics trade fairs in Asia. This integration offers ISP EXPO participants an additional opportunity to connect with a broader range of industry experts and explore synergies with other areas of electronics manufacturing.

The fair's venue, Tokyo Big Sight, is a renowned international exhibition center in Tokyo, known for its distinctive architecture and excellent facilities. It provides an ideal setting for this high-profile event, characterized by its high-quality exhibitions and professional audience.

Highlights of the ISP EXPO include interactive lectures by industry leaders, demonstration areas for the latest products and technologies, and networking events that enable participants to establish contacts and explore business opportunities. The expo serves as an important platform for companies to showcase their latest innovations and stay informed about the challenges and opportunities in the IC packaging industry.

The IC & SENSOR PACKAGING EXPO takes place for the 40th time on 3 days from Wed., 21.01.2026 to Fri., 23.01.2026 in Tokyo.