IC & SENSOR PACKAGING EXPO Tokyo
21. - 23. January 2026 | Trade fair on IC finishing and packaging
The ISP EXPO, also known as the IC & SENSOR PACKAGING EXPO, is a trade fair focusing on the final assembly and packaging of integrated circuits (ICs). This annual event, taking place every January, was initiated by RX Japan Ltd. and has established itself as Asia's leading exhibition in this sector.
The ISP EXPO is distinguished by its comprehensive presentation of advanced equipment, materials, and services specifically designed for IC final assembly and packaging. The expo provides a unique platform for industry professionals to stay informed about the latest technologies and trends, establish business relationships, and exchange knowledge.
A key feature of the ISP EXPO is its integration with NEPCON Japan, one of the largest electronics trade fairs in Asia. This integration offers ISP EXPO participants an additional opportunity to connect with a broader range of industry experts and explore synergies with other areas of electronics manufacturing.
The fair's venue, Tokyo Big Sight, is a renowned international exhibition center in Tokyo, known for its distinctive architecture and excellent facilities. It provides an ideal setting for this high-profile event, characterized by its high-quality exhibitions and professional audience.
Highlights of the ISP EXPO include interactive lectures by industry leaders, demonstration areas for the latest products and technologies, and networking events that enable participants to establish contacts and explore business opportunities. The expo serves as an important platform for companies to showcase their latest innovations and stay informed about the challenges and opportunities in the IC packaging industry.
The IC & SENSOR PACKAGING EXPO takes place for the 40th time on 3 days from Wed., 21.01.2026 to Fri., 23.01.2026 in Tokyo.
21.01.2026 - 23.01.2026*
Wednesday - Friday, 3 days
daily from 10:00 to 17:00 h
Audience:
professional visitors only
Cycle:
annually
Local time:
17:58 h (UTC +09:00)
Fair location:
Tokyo Big Sight,3-21-1 Ariake Kotu-ku, 135-0063 Tokyo, Tokyo, Japan
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for trade fair date in Tokyo
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RX Japan Ltd.
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - Ku
1630570 Tokyo, Japan
Display e-mail address
www.rxjapan.jp
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22. - 24. January 2025
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24. - 26. January 2024
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25. - 27. January 2023
Fair location:
Tokyo Big Sight,3-21-1 Ariake Kotu-ku, 135-0063 Tokyo, Tokyo, Japan
Hotels
for trade fair date in Tokyo
Product groups: clean room technology, IC packaging systems, materials for IC packaging, microelectronics, nanotechnology, semiconductor production systems, test systems, thermal management solutions, wafer processing systems, …
Disclaimer: No responsibility is taken for the correctness of this information. Errors and alterations excepted! Fair dates and exhibition sites are subject to change by the respective trade fair organiser.
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FAQ
Where does the IC & SENSOR PACKAGING EXPO taking place?
The IC & SENSOR PACKAGING EXPO fair takes place in Tokyo, at the Tokyo Big Sight.
When is the IC & SENSOR PACKAGING EXPO taking place?
Visit the IC & SENSOR PACKAGING EXPO from 21. - 23. January 2026.
How often does the IC & SENSOR PACKAGING EXPO take place?
The IC & SENSOR PACKAGING EXPO takes place annually.
What kind of fair is the IC & SENSOR PACKAGING EXPO?
The IC & SENSOR PACKAGING EXPO is an exhibition for Manufacturing Technology, Electronics and Electrical.
What are the opening hours of the IC & SENSOR PACKAGING EXPO in Tokyo?
Opening hours: daily from 10:00 to 17:00 h