NEPCON Japan Tokoname

The NEPCON Japan, an annual trade fair for electronics development and manufacturing. The name NEPCON stands for "New Electronic Packaging Conference" and reflects the fair's objective: to present and promote innovations in electronic packaging and manufacturing.

The fair covers a wide range of topics essential to the electronics manufacturing industry. These include assembly and manufacturing equipment, testing and measurement devices, semiconductor and sensor packaging technologies, electronic components and materials, printed circuit boards, precision process technologies, and developments in LED and laser diode technologies.

Visitors can discover a variety of products, including placement machines, soldering machines, X-ray inspection systems, IC packaging simulation software, connectors, multilayer printed circuit boards, precision sheet metalworking tools, LEDs, sealing machines, and reliability and evaluation inspection systems.

NEPCON Japan attracts professionals from various sectors, including household appliance manufacturers, aviation and maritime equipment providers, factory automation vendors, and medical device producers. It offers a platform to explore the latest products, gain knowledge through conferences and seminars, and exchange information about the latest trends and technologies.

Another highlight is the parallel events on current topics such as automotive technologies and smart logistics solutions, emphasizing the fair's relevance to future technology trends.

In summary, NEPCON Japan is not just a trade fair, but a pivotal forum for technological exchange and innovation that significantly shapes the global electronics and manufacturing industry.

The NEPCON Japan will take place on 3 days from Wednesday, 25. November to Friday, 27. November 2026 in Tokoname.