Adhesion & Bonding Expo Tokyo Chiba

09. - 11. October 2024 | International trade fair for adhesives and connection technology

The Adhesion & Bonding Expo is a prominent trade fair held at Makuhari Messe in Chiba, near Tokyo. Organized by RX Japan Ltd., a subsidiary of the Reed Exhibitions Group, the expo focuses on trade shows and events in various industries. The fair targets companies and experts in the fields of adhesives and sealants, surface treatment and finishing, as well as industry-specific technologies and services. Participants at the Adhesion & Bonding Expo can learn about current products, technologies, and trends in the field of adhesion and bonding technology.

The event highlights innovative solutions for industries such as automotive, aerospace, electronics, construction, and medical technology. A wide range of relevant products and technologies for various applications and industries are showcased, including adhesives like epoxy resins, polyurethanes, silicones, cyanoacrylates, hot melt adhesives, and UV-curing adhesives. Additionally, sealants such as silicone sealants, polyurethane sealants, acrylic sealants, and butyl sealants are displayed. Furthermore, surface treatments, adhesive application systems, and joining methods for composite materials are presented. The Adhesion & Bonding Expo is part of the Highly-functional Material Week, a series of events that bring together various trade shows on high-performance materials and technologies. Held annually in Tokyo, it offers an essential platform for professionals and companies from different industries. The Adhesion & Bonding Expo takes place in both Chiba near Tokyo and Osaka, with an annual rotation in spring in Osaka and autumn in Chiba, enabling the event to reach a broad spectrum of participants and exhibitors from different regions of Japan and beyond. This provides attendees with an excellent opportunity to present their products and services to an even larger audience and learn about the latest developments in the industry.

The Adhesion & Bonding Expo Tokyo will take place on 3 days from Wednesday, 09. October to Friday, 11. October 2024 in Chiba.

In 172 days
Date:
09.10.2024 - 11.10.2024*
Wednesday - Friday, 3 days
Trade Show Contact
Display e-mail address
www.material-expo.jp

Audience:
professional visitors only

Cycle:
annually

Local time:
00:52 h (UTC +09:00)

Fair location:

Makuhari Messe,
2-1, Nakase, Mihama-ku, 2610023 Chiba, Chiba, Japan

Hotels

for trade fair date in Chiba


Fair organizer
RX Japan
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - Ku
1630570 Tokyo, Japan
Display e-mail address
www.rxjapan.jp
Past editions:
  • 04. - 06. October 2023

Fair location:

Makuhari Messe,
2-1, Nakase, Mihama-ku, 2610023 Chiba, Chiba, Japan

Hotels

for trade fair date in Chiba


Product groups: adhesive application systems, composite joining methods, cyanoacrylate adhesives, epoxy resin adhesives, hot melt adhesives, polyurethane adhesives, sealing materials, silicone adhesives, surface preparation technologies, …

Disclaimer: No responsibility is taken for the correctness of this information. Errors and alterations excepted! Fair dates and exhibition sites are subject to change by the respective trade fair organiser.

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Co-located

Other co-located events

Gardex
Plastic Japan Tokyo
Photonix
Metal Japan Tokio
Ceramic Japan Tokyo
Paint & Coating Japan Tokyo
Sustainable Material Expo Tokyo
Finetech Japan Tokyo


#adhesionandbondingexpo

Adhesion & Bonding Expo
08. - 10. May 2024
Osaka

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FAQ

Where does the Adhesion & Bonding Expo Tokyo taking place?
The Adhesion & Bonding Expo Tokyo fair takes place in Chiba, at the Makuhari Messe.

When is the Adhesion & Bonding Expo Tokyo taking place?
Visit the Adhesion & Bonding Expo Tokyo from 09. - 11. October 2024.

How often does the Adhesion & Bonding Expo Tokyo take place?
The Adhesion & Bonding Expo Tokyo takes place annually.

What kind of fair is the Adhesion & Bonding Expo Tokyo?
The Adhesion & Bonding Expo Tokyo is an exhibition for Plastics, Petrochemicals and Raw materials.