Adhesion & Bonding Expo Osaka

The Adhesion & Bonding Expo is a significant trade fair held at INTEX Osaka, one of the largest exhibition and event centers in Japan. Founded in 1985, INTEX Osaka is conveniently located near Kansai Airport and the Port of Osaka. The Adhesion & Bonding Expo is organized by RX Japan Ltd., a subsidiary of the Reed Exhibitions Group, which specializes in organizing trade fairs and events in various industries. The fair targets companies and professionals in the fields of adhesives and sealants, surface treatment and finishing, as well as application-specific technologies and services.

At the Adhesion & Bonding Expo, participants can learn about the latest products, technologies, and trends in adhesion and bonding technology. The fair's focus is on innovative solutions for industries such as automotive, aerospace, electronics, construction, and medical technology. A wide range of products and technologies relevant to various applications and industries are exhibited, including adhesives such as epoxy resins, polyurethanes, silicones, cyanoacrylates, hot-melt adhesives, and UV-curing adhesives, as well as sealants like silicone sealants, polyurethane sealants, acrylic sealants, and butyl sealants. In addition, surface treatments, adhesive application systems, and joining methods for composite materials are presented. The Adhesion & Bonding Expo is part of the Highly-functional Material Week, an event series that brings together various trade fairs focused on high-performance materials and technologies under one roof. The Highly-functional Material Week takes place annually in Osaka and serves as an essential platform for professionals and companies from different industries. In addition to the Osaka location, the Adhesion & Bonding Expo is also held in Chiba, a major exhibition center near Tokyo. The annual rotation, with the event held in Osaka in spring and Chiba near Tokyo in autumn, allows the fair to attract a broad spectrum of participants and exhibitors from various regions of Japan and beyond. This event provides participants with an excellent opportunity to present their products and services to an even larger audience and learn about the latest developments in the industry.

The Adhesion & Bonding Expo will take place on 3 days from Wednesday, 08. May to Friday, 10. May 2024 in Osaka.