InterMold Osaka

InterMold Osaka is an annual trade fair specializing in tooling, mold making, design, and product development. Since its establishment by the INTERMOLD Development Association TVO Expro Ltd., it has become an indispensable platform accessible exclusively to industry professionals.

The event is held at the INTEX Osaka International Exhibition Center in Osaka, a modern and easily accessible venue that provides ideal conditions for international exhibitions. InterMold's unique concept integrates various product areas along the entire process chain—from design and prototyping to mass production. This integrated approach fosters synergies in process optimization and efficiency enhancement, making the fair a key event for decision-makers and innovators in the industry.

In addition to the exhibition, InterMold serves as a hub for professional exchange. Designers, developers, engineers, technicians, and executives gather here to discuss the latest innovations and trends. The fair is complemented by technical conferences and networking events, offering participants valuable opportunities for exchange and initiating potential business contacts.

Another feature of InterMold is its comprehensive range of products and services covering all aspects of product development—from advanced software solutions to innovative tooling and molding technologies. Annually, new and improved technologies are showcased, aimed at revolutionizing production processes and reducing time to market.

Overall, InterMold Osaka is an indispensable event for professionals in the mold-making and design industry, seeking pioneering solutions and wanting to make their production processes more efficient. With its annual occurrence, the fair remains up-to-date and relevant for the rapidly evolving industry.

The InterMold in Osaka took place from Wednesday, 17. April to Friday, 19. April 2024.