PACKCON Shenzhen

PACKCON is Asia’s premier trade fair for packaging solutions and a key platform for professionals in the packaging industry. Held annually at changing locations across China, the event reflects a dynamic character and offers direct access to diverse regional markets.

The fair is organized by RX China, an experienced exhibition organizer and part of the global RX Group, known for hosting high-quality industry events with international reach. PACKCON also forms a central component of the WEPACK exhibition network, which includes specialized shows such as SinoCorrugated, SinoFlexPack, FOOD PACK & TECH, SinoPaper, DPrint, and SinoFoldingCarton. Together, they create a comprehensive trade fair ecosystem centered on packaging technologies, materials, and machinery.

What sets PACKCON apart is its clear focus on industrial applications and concrete business opportunities. The full spectrum of modern packaging solutions is on display – ranging from paper, plastic, metal, and glass packaging to intelligent packaging technologies and innovative biodegradable materials. The offering is complemented by packaging machinery and equipment, accessories, labeling solutions, and a wide array of packaging-related services. Exhibits are clearly structured into thematic zones tailored to specific sectors such as retail, food and beverages, electronics, automotive, hospitality, and sustainable packaging innovation.

A defining feature of PACKCON is its depth of content and international reach. It attracts trade visitors from a wide range of industries – including packaging designers, product developers, machinery manufacturers, buyers from commerce and industry, and decision-makers from the food and beverage, electronics, automotive, and consumer goods sectors. Exhibitors represent the full spectrum of the packaging value chain, from established global market leaders to cutting-edge startups.

In addition to product showcases, PACKCON offers a strong supporting program featuring expert conferences, live demonstrations, and knowledge-sharing forums. This makes the fair a key meeting point for networking, knowledge exchange, and dialogue within the industry – providing genuine added value for all participants.

With its strong ties to the fast-growing Chinese market, PACKCON is a strategically important platform for both domestic and international companies. It provides access to the world’s largest packaging market while also offering insights into the latest trends, technologies, and standards in the Asian packaging industry.

PACKCON venues are modern, easily accessible, and located in major economic hubs. Outstanding infrastructure, direct connections to airports and hotels, and close integration with other specialized trade fairs make PACKCON not only worthwhile – but virtually essential for professionals in the packaging sector.

The PACKCON will take place on 3 days from Wednesday, 15. April to Friday, 17. April 2026 in Shenzhen.