Bondexpo Stuttgart

The Bondexpo, hosted in the stunning venue of Messe Stuttgart, has become a pivotal gathering for the international adhesive technology industry since its inception in 2007 by P. E. Schall GmbH & Co. KG. As an annual event taking place every October, it has established itself both as a global information and knowledge hub, and as a central event for professionals, visitors, and exhibitors.

What sets the Bondexpo apart is its comprehensive portrayal of the entire process chain of joining and bonding through techniques such as gluing, casting, sealing, and foaming. Not only are innovative solutions for current practical applications showcased, but attendees also gain insights into future challenges and developments in the industry. With a special emphasis on the use of new adhesives – especially in lightweight construction for vehicles, devices, and equipment – the exhibition underscores the growing significance of these technologies.

Another highlight of the Bondexpo is its synergy with Motek, the world's leading trade fair for production and assembly automation. The close link between the two fairs allows visitors to recognize the relevance of adhesive, casting, sealing, and foaming processes in the context of highly automated processing systems like handling and robotics.

In addition to the exhibition, Bondexpo offers an exhibitor forum where industry experts present current topics and products of adhesive technology through lectures. This interactive component makes the Bondexpo a vibrant platform for exchange and continued learning.

In conclusion, the Bondexpo is not just an exhibition but an experience – an annual highlight for all who are passionate about the world of adhesive technology. Located in Stuttgart, it attracts thousands of visitors, reaffirming its position as an indispensable event in the industry.

Exhibitors and visitors meet for the 17th time on the Bondexpo on 4 days from Tue., 08.10.2024 to Fri., 11.10.2024 in Stuttgart.