Bondexpo Stuttgart

08. - 11. October 2024 | International trade fair for bonding technology

The Bondexpo, hosted in the stunning venue of Messe Stuttgart, has become a pivotal gathering for the international adhesive technology industry since its inception in 2007 by P. E. Schall GmbH & Co. KG. As an annual event taking place every October, it has established itself both as a global information and knowledge hub, and as a central event for professionals, visitors, and exhibitors..

What sets the Bondexpo apart is its comprehensive portrayal of the entire process chain of joining and bonding through techniques such as gluing, casting, sealing, and foaming. Not only are innovative solutions for current practical applications showcased, but attendees also gain insights into future challenges and developments in the industry. With a special emphasis on the use of new adhesives – especially in lightweight construction for vehicles, devices, and equipment – the exhibition underscores the growing significance of these technologies.

Another highlight of the Bondexpo is its synergy with Motek, the world's leading trade fair for production and assembly automation. The close link between the two fairs allows visitors to recognize the relevance of adhesive, casting, sealing, and foaming processes in the context of highly automated processing systems like handling and robotics.

In addition to the exhibition, Bondexpo offers an exhibitor forum where industry experts present current topics and products of adhesive technology through lectures. This interactive component makes the Bondexpo a vibrant platform for exchange and continued learning.

In conclusion, the Bondexpo is not just an exhibition but an experience – an annual highlight for all who are passionate about the world of adhesive technology. Located in Stuttgart, it attracts thousands of visitors, reaffirming its position as an indispensable event in the industry.

Exhibitors and visitors meet for the 17th time on the Bondexpo on 4 days from Tue., 08.10.2024 to Fri., 11.10.2024 in Stuttgart.

In 169 days
Date:
08.10.2024 - 11.10.2024*
Tuesday - Friday, 4 days
Trade Show Contact
Display e-mail address
www.bondexpo-messe.de

Audience:
professional visitors only

Cycle:
annually

Year of foundation:
2007

Local time:
22:06 h (UTC +02:00)

Fair location:

Messe Stuttgart,
Messepiazza 1, 70629 Stuttgart, Baden-Wurttemberg, Germany

Hotels

for trade fair date in Stuttgart


Fair organizer
P. E. Schall GmbH & Co. KG
Gustav-Werner-Str. 6
72636 Frickenhausen, Germany
Tel: +49 (0)7025 92060
Fax: +49 (0)7025 9206880
Display e-mail address
www.schall-messen.de
Past editions:
  • 10. - 13. October 2023
  • 04. - 07. October 2022
  • 05. - 08. October 2021
  • 07. - 10. October 2019
  • 08. - 11. October 2018
  • 09. - 12. October 2017
    • 80 exhibitors from 13 countries
    • 38421 visitors
  • 10. - 13. October 2016
  • 05. - 08. October 2015
  • 06. - 09. October 2014
    • 116 exhibitors from 10 countries

Fair location:

Messe Stuttgart,
Messepiazza 1, 70629 Stuttgart, Baden-Wurttemberg, Germany

Hotels

for trade fair date in Stuttgart


Product groups: adhesive technology, adhesives, application equipment, casting materials, composite materials, encapsulation technologies, foaming, insulation technology, joining techniques, measurement technology, metering devices, network technology, raw materials, sealants, sealing technology, testing technology, …

Disclaimer: No responsibility is taken for the correctness of this information. Errors and alterations excepted! Fair dates and exhibition sites are subject to change by the respective trade fair organiser.

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Co-located

Other co-located events

Motek


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FAQ

Where does the Bondexpo taking place?
The Bondexpo fair takes place in Stuttgart, at the Messe Stuttgart.

When is the Bondexpo taking place?
Visit the Bondexpo from 08. - 11. October 2024.

How often does the Bondexpo take place?
The Bondexpo takes place annually.

What kind of fair is the Bondexpo?
The Bondexpo is an exhibition for Commodities, Measurement Technology and Material Handling.