Bondexpo Stuttgart

The Bondexpo is an international trade fair for bonding technologies, which takes placein Stuttgart. The show has established itself as a global industry and users meeting point since its foundation in 2007. It represents the entire process chain of assembling and joining by bonding, potting, sealing and foaming and offers solutions for practical applications and future challenges facing the industry. Especially the use of new adhesives becomes increasingly important in the field of light framing, which extends not only to the area of vehicles but also to appliances and equipment. In addition, the Bondexpo acts as a link between research and development and application and usage. It shows new future paths in the areas of adhesives, insulation, foaming, sealing and encapsulation, which are presented in the technical context of production by the combination of Bondexpo with Motek, the world's leading trade fair for automation in production and assembly.

Precisely adhesive, potting, sealing and foaming are essential components of a highly automated processing in handling and robotic systems. The exhibition is accompanied by an exhibitor forum in which experts address current topics and products of bonding technology to visitors and exhibitors during presentations. Thus, the Bondexpo has established itself as information and knowledge platform, making it an essential event in the industry.

This year the Bondexpo takes place on 4 days from Tue., 10.10.2023 to Fri., 13.10.2023 in Stuttgart already for the 16th time.