bonding Hamburg

The Bonding Career Fair is a well-established annual event taking place on the campus of the Technical University of Hamburg (TUHH) - NIT. It is organized by the bonding-student initiative e.V., a non-profit organization founded by students in Germany, dedicated to fostering connections between students and businesses. The first Bonding Fair was held as early as 1988, in Aachen and has since become a staple at various locations throughout Germany. The Bonding Fair is aimed at students and graduates from various disciplines and offers a wide range of companies and institutions showcasing their products and services.

The main focus of the fair revolves around careers, internships, trainee programs, thesis topics, and direct entry opportunities. Highlights include personal consultation sessions, presentations, and workshops on applications, career planning, and industry-specific topics. A distinctive feature of the Bonding Fair is the direct contact with HR representatives, which gives students valuable insights into the requirements and expectations of the companies. In summary, the Bonding Fair is a significant platform for students and businesses to interact and establish networks for a successful professional future. The fair's location, the TUHH - NIT campus in Hamburg, is renowned for its excellent research and education in technical and engineering disciplines. The venue provides a professional and inspiring atmosphere, fostering the exchange between companies and students.

The bonding in Hamburg took place on Tuesday, 20. June 2023.