bonding Dresden

The bonding Company Contact Fair Dresden is a career fair held every spring, specifically tailored for students and graduates of engineering, natural sciences, and economics. The name "bonding" not only refers to the non-profit organization bonding-studenteninitiative e.V., which organizes the event, but also symbolizes the idea of "connecting" talents with potential employers – serving as a bridge between academic studies and professional careers.

The venue is the historic Alte Mensa located on the campus of Technische Universität Dresden – a centrally situated meeting point where companies from a wide range of industries engage with ambitious young professionals. Once a year, this space transforms into a vibrant networking platform that goes far beyond the typical character of a trade fair. At its heart are personal interaction, practical discussions, and exchanges at eye level.

The fair offers a wide range of entry-level opportunities – from internships and thesis collaborations to trainee programs and direct employment. Companies from sectors such as mechanical engineering, electrical engineering, IT, consulting, automotive, and auditing use this platform to present themselves as attractive employers, showcase their corporate culture, and engage directly with potential candidates.

As part of a nationwide series of fairs held at university locations such as Aachen, Karlsruhe, and Stuttgart, the Dresden edition carries the unique spirit of an innovation-driven region. The city stands out with its dynamic high-tech, research, and industrial landscape – making it a compelling environment for both employers and young professionals.

What makes the fair particularly valuable is its practical relevance, proximity to its target audience, and clear benefits for visitors. In addition to company booths, attendees can access a range of career-enhancing services, including résumé checks, one-on-one career counseling, professional application photos, and inspiring talks from industry experts. This interactive and student-oriented approach makes the fair a genuine springboard for launching a successful career.

The main target group comprises students and graduates from technical and business-related disciplines who are actively preparing for their professional future. At the same time, companies benefit from the opportunity to connect with emerging talent in an authentic setting – direct, approachable, and personal.

The Alte Mensa is not only easy to reach by public transport and centrally located, but also carries symbolic significance: it’s a place where knowledge, future prospects, and personal development come together – the ideal setting for anyone looking to take an active role in shaping their career path.

The bonding will take place on 3 days from Tuesday, 06. May to Thursday, 08. May 2025 in Dresden.